Test Item |
Test Method MIL-STD |
Condition |
Samples Size |
ACC/ REJ No. |
Frequency/ Report |
1. Temp. Cycle (T/C) |
(1) MIL-STD-883D 1010.COND.C (2) JIS C7021 A-4 |
-65¢XC(30min.)¡÷25¢XC(5min.)¡÷+150¢XC(30min.), 50 Cycles |
22 |
0/1 |
Once/Month |
2. High Temp. Storage (HTS) |
(1) MIL-STD-750 1031 (2) JIS C7021 B-10 |
Ta=150¢XC 168/500/1000 Hours |
22 |
0/1 |
Once/Month |
3. Low Temp. Storage (LTS) |
JIS C7021 B-12 |
Ta=-50¢XC 168/500/1000 Hours |
22 |
0/1 |
Require of Customer |
4. Moisture Resistance (M/R) |
(1) MIL-STD-7501021 (2) JIS C7021 B-11-C |
Ta=85¢XC, RH=85% 168/500/1000 Hours |
22 |
0/1 |
Once/Month |
5.Pressure Cooker Test (PCT) |
EIAJ-IC-121 |
Ta=121¢XC¡Ó2¢XC RH=100%, 15PSIG 168 Hours |
22 |
0/1 |
Once/Month |
6. Operating Life Test (OPL) |
JIS C7021 B-4 |
Ta=25¢XC,*max 168/500/1000 Hours 0.7* VCEO |
22 |
0/1 |
Once/Month |
7. High Temp. Reverse Bias (HTRB) |
JIS C7021 B-8 |
Ta=150¢XC 168/500/1000 HoursVCB max*0.8 |
22 |
0/1 |
Once/Month |
8. Thermal Shock |
(1) MIL-STD-883D 1011.COND.A (2) JIS C7021 A-3 |
Ta=0¢XC/+100¢XC T=5min/5min 5 Cycles |
22 |
0/1 |
Require of Customer |
9. Solderability Test (S/T) |
883-2003 |
Ta=245¢XC¡Ó5¢XC (HTH) Ta=215¢XC¡Ó5¢XC (SMT) T=5¡Ó0.5sec Cover Area>90% |
22 |
0/1 |
Once/Month |